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Pressure
Freescale Semiconductor
+
MPX2202 Rev 6, 10/2008
200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors
The MPX2202 devices series are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/ motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc.
MPX2202 Series
0 to 200 kPa (0 to 29 psi) 40 mV Full Scale (Typical)
Application Examples
* * * * * * * Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Barometers Altimeters
Features
* * * * * Temperature Compensated Over 0C to +85C Easy-to-Use Chip Carrier Package Options Available in Absolute, Differential and Gauge Configurations Ratiometric to Supply Voltage Available in Easy-to-Use Tape and Reel ORDERING INFORMATION
Case Device Name No. None Unibody Package (MPX2202 Series) MPX2202A 344 * MPX2202DP 344C MPX2202AP MPX2202GP MPX2202ASX 344B 344B # of Ports Single Dual Gauge
Pressure Type Differential
Absolute
Device Marking MPX2202A MPX2202DP MPX2202AP MPX2202GP MPX2202A MPXV2202GP
* * * * * * * * * * * * * * * * * * * * * * * * * *
344F Small Outline Package (MPXV2202 Series) MPXV2202GP 1369 MPXV2202DP MPXV2202GC6TI MPXV2202GC6U 1351 482A
MPXV2202DP MPXV2202G MPXV2202G MPXM2202D MPXM2202D MPXM2202A MPXM2202GS MPXM2202GS MPXM2202AS
482A MPAK Package (MPXM2202 Series) MPXM2202D 1320 * MPXM2202DT1 1320 * MPXM2202A MPXM2202GS MPXM2202GST1 MPXM2202AS 1320 1320A 1320A 1320A
*
(c) Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX2202A CASE 344-15
MPX2202AP/GP CASE 344B-01
MPX2202DP CASE 344C-01
MPX2202ASX CASE 344F-01
SMALL OUTLINE PACKAGES
MPAK
MPXV2202GP CASE 1351-01
MPXV2202GP CASE 1369-01
MPXV2202GP CASE 482A-01
MPXM2202A CASE 1320-02
MPXM2202GS/AS CASE 1320A-02
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Operating Characteristics
Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristics Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) MPX2202D, MPXM2202D/G Series MPX2202A, MPXM2202A Series Sensitivity Linearity(5) MPXM2202D/G, MPX2202D Series MPXM2202A, MPX2202A Series Pressure Hysteresis(5) (0 to 200 kPa) Temperature Hysteresis(5) (-40C to +125C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. -- -0.6 -1.0 -- -- -2.0 -1.0 1000 1400 -- -- -- -- -- 0.1 0.5 -- -- -- -- 1.0 20 0.5 0.4 1.0 2.0 1.0 2500 3000 -- -- -- %VFSS Voff V/P -1.0 -2.0 -- -- -- 0.2 1.0 2.0 -- mV Symbol POP VS Io VFSS Min 0 -- -- 38.5 Typ 10 6.0 40 Max 200 16 41.5 Unit kPa Vdc mAdc mV
mV/kPa
-- -- TCVFSS TCVoff Zin Zout tR -- --
%VFSS %VFSS %VFSS mV ms ms %VFSS
MPX2202 Sensors Freescale Semiconductor 3
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Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Max Value
400 -40 to 125 -40 to 125
Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Voltage Output versus Applied Differential
The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure
VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND
(P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
2 4
Sensing Element
+VOUT -VOUT
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic
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On-Chip Temperature Compensation and Calibration
40 35 30 25 Output (mVDC) 20 15 10 5 0 kPa PSI -5 0
VS = 10 VDC TA = 25C P1 > P2 MAX
TYP Span Range (TYP) MIN
25
50 7.25
75
100 125 14.5 Pressure
150 21.75
175
200 29
Offset (TYP)
Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2202 series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics.
Silicone Gel Die Coat Wire Bond
Differential/Gauge Die P1
Stainless Steel Metal Cover Epoxy Case
Silicone Gel Die Coat Wire Bond
Absolute Die P1
Stainless Steel Metal Cover Epoxy Case
Lead Frame
Differential/Gauge Element P2
Bond Die
Lead Frame
Absolute Element P2
Die Bond
Figure 3. Cross Sectional Diagram (not to scale) Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2202 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
Least Squares Fit Exaggerated Performance Curve
Least Square Deviation Straight Line Deviation
Relative Voltage Output
End Point Straight Line Fit
Offset 0 50 Pressure (% Full Scale) 100
Figure 4. Linearity Specification Comparison
MPX2202 Sensors Freescale Semiconductor 5
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX Table 3. Pressure (P1) Side Delineation
Part Number MPX2202A MPX2202DP MPX2202GP/AP MPX2202ASX MPX2202GP MPX2202DP MPXV2202GP MPXV2202DP MPXV2202GC6TI/U MPXM2202A/ATI/DT/DTI MPXM2202GS/GSTI/AS/ASTI Case Type 344 344C 344B 344F 1369 1351 1369 1351 482A 1320 1320A Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking Side with Port Attached Side with Part Marking Side with Port Attached Side with Part Marking Side with Port Attached Pressure (P1) Side Identifier
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
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PACKAGE DIMENSIONS
-A-
4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B- G
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-T-
SEATING PLANE
CASE 482A-01 ISSUE A DATE 05/13/98
MPX2202 Sensors Freescale Semiconductor 7
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PACKAGE DIMENSIONS
C R M
1
B
-AN
PIN 1
1234
2
3
4
Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00
L
-TJ
SEATING PLANE
G F
M
F Y
D 4 PL 0.136 (0.005)
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE AA UNIBODY PACKAGE
SEATING PLANE
-TR H N
PORT #1 POSITIVE PRESSURE (P1)
-AU L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC
-Q-
B
12 34
PIN 1
K
S
-P0.25 (0.010) J C
M
TQ
S
F G D 4 PL 0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT
CASE 344B-01 ISSUE B UNIBODY PACKAGE
MPX2202 8 Sensors Freescale Semiconductor
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PACKAGE DIMENSIONS
V R
PORT #2 PORT #1
-AU W H N
PORT #2 VACUUM (P2)
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38
PORT #1 POSITIVE PRESSURE (P1)
-QSEATING PLANE
B
SEATING PLANE
PIN 1
1234
-P-TJ C -T0.25 (0.010)
M
K S
TQ
S
F G D 4 PL
0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B UNIBODY PACKAGE
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92
V
N R
PORT #1 POSITIVE PRESSURE (P1)
B
-P0.25 (0.010)
M
PIN 1
TQ
M
4
3
2
1
S K
J
F D 4 PL 0.13 (0.005)
G
STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT
M
TP
S
Q
S
CASE 344F-01 ISSUE B UNIBODY PACKAGE
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PACKAGE DIMENSIONS
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
CASE 1320-02 ISSUE B MPAK
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PACKAGE DIMENSIONS
CASE 1320-02 ISSUE B MPAK
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PACKAGE DIMENSIONS
PIN 4
PIN 1
CASE 1320A-02 ISSUE A MPAK
MPX2202 16 Sensors Freescale Semiconductor
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PACKAGE DIMENSIONS
CASE 1320A-02 ISSUE A MPAK
MPX2202 Sensors Freescale Semiconductor 17
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MPX2202 Rev. 6 10/2008

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